AK-455 is a new improved formulated thermal compound that gives hi-performance heat transfer between the CPU and heatsink. Minimised resistance and maximised efficiency truly enables you to get more from your cooler. Easy to use. RoHS compliant.

Hi-performance heat transfer between the CPU and heatsink
Maximum thermal conductivity, 2.4W/mK
Easy to apply with spreader card
Multi-language instructions included
RoHS Compliant


Installation

1. Before applying the thermal compound, please make sure the top surface of the CPU die or heat spreader is perfectly clean. If the die has any residue of old thermal compound present, clean with Isopropyl or AKASA Timclean.

2. Place a small amount of AK-455 on the surface of the die, smooth across surface by using the spreader card included. A thin film is ideal, extra thermal compound will not improve performance.

3.Now you are ready to install your CPU cooler.

Thermal Conductivity: >2.4W/m-k

Thermal Resistance: <0.04ºC-In2/W

10% Silver Oxide Compounds

Net Weight: 1.5g

The Akasa Group of companies was founded in 1997 with offices in Taipei and London. Our management team are all experienced in Electronic and Electro-mechanical product development. We currently have offices in London, Taipei, Rotterdam and Sao Paulo, Brazil